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Printed circuit board insulating film - メーカー・企業と製品の一覧

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5G LCP FCCL "SAR25C12"

Next-generation high-speed communication 5G, automotive millimeter-wave radar, FPC for LiDAR, FCCL applications.

**Product** 5G LCP FCCL "SAR25C12" **What is SAR25C12** As the frequency increases, the amount of information that can be transmitted per unit time can be accelerated and made larger. For next-generation high-speed communication, it is effective that the dielectric loss decreases as the dielectric constant and dielectric loss tangent of the FPC material decrease. In addition to these excellent electrical characteristics of low dielectric constant and low dielectric loss tangent, LCP, which also has low moisture absorption, heat resistance, and a coefficient of thermal expansion comparable to metals, as well as moldability, is an essential resin material for next-generation high-speed communication. The liquid crystal polymer film flexible copper-clad laminate "SAR25C12" is a groundbreaking product that leverages its excellent compatibility with copper foil for insulation film applications in flexible printed circuits (FPC). **Features of LCP** - Excellent electrical properties at high frequencies - Excellent heat resistance - Insulating substrate with thermal conductivity - Low moisture absorption (low dielectric) - Thermoformability at 250°C - Gas barrier properties - Anisotropic *For more details, please refer to the PDF document or feel free to contact us.*

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